Low dielectric thermoplastic polyimide Therplim for high-speed communication devices (5G)
Suitable for super engineering plastics with good dielectric properties in a wide frequency range and materials for next-generation (5G) communication devices.
Due to its excellent dielectric properties and high temperature and humidity resistance, "Therplim" can be used in 5G-related materials (copper-clad laminates), CFRP raw materials, and audio equipment components. [Features] ■ Good dielectric characteristics across a wide frequency range, including the millimeter wave region (10GHz 2.7) ■ High heat resistance (Tm323℃/Tg185℃) ■ Good chemical resistance, insoluble in solvents ■ Can be processed from films below 25 μm to large components with a thickness of 100 mm * For more details, please refer to the PDF document or feel free to contact us.
- 企業：三菱ガス化学株式会社 グリーン・エネルギー＆ケミカル事業部門
- 価格：Other
